Electronic chip packaging involves several micro plastic components that play crucial roles in protection, connection, and ensuring the normal operation of the semiconductor. Here are some common micro plastic components:
- Packaging Substrate: This is a support board for the chip, often made of plastic materials such as Organic Substrate, providing structural support and connections.
- Ball Grid Array (BGA): BGA is a packaging technology with small ball-shaped connection points at the bottom, typically made of plastic materials.
- Encapsulant: A plastic material used to encapsulate and protect the entire chip, safeguarding internal components from external environmental factors.
- Light Guide Pillar: These small plastic pillars guide and distribute light, contributing to optimizing illumination systems.
- Connectors and Sockets: Small plastic components used to connect the electronic chip to other circuit elements.
- Molding Compound: A plastic resin used to encapsulate and protect areas like conductive wires and solder points.
- Screw Hole Covers: Small plastic covers used to protect internal components from dust and damage by covering screw holes.
- Labels and Markings: Small plastic labels or markings are used to indicate information such as chip model, manufacturer, and other relevant details.
